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August 17, 2017

PiBond exhibits at SEMICON Taiwan 2017

Taipei Nangang Exhibition Center, September 13-15, 2017 – SEMICON Taiwan 2017. PiBond participates in SEMICON Taiwan event in Taipei, Taiwan. You can find us at...

May 12, 2017

PiBond at SEMICON Europa

Munich, Germany, November 14-17, 2017. PiBond participates in SEMICON Europa event in Munich, Germany. This year’s SEMICON Europa event will be co-located with productronica, the...

February 20, 2017

PiBond exhibits at SEMICON China 2017

Shanghai New International Expo Centre, March 14-16, 2017. PiBond participates in SEMICON China event in Shanghai at the Nagase booth No. 5617 in hall W5....

October 25, 2016

PiBond materials for MEMS, TSV and IC fabrication at SEMICON Europa

Alpexpo, Grenoble, October 25-27, 2016 – SEMICON Europa. PiBond participates in SEMICON Europa event in Grenoble, France. Our booth No. is 541. We exhibit our...

October 19, 2016

PiBond pioneers a new material approach for MEMS and 3D IC manufacturing.

Pibond is awarded patent for its SAP technology platform.   Helsinki, Oct. 19, 2016 — PiBond today announced the latest key milestone in its innovative SAP...

September 22, 2016

New materials with high refractive index for optical applications

Rapidly emerging global megatrends such as Internet of Things, augmented reality as well as new waves of automotive and security related applications have become key...

September 07, 2016

PiBond materials for MEMS, TSV and IC fabrication at SEMICON Taiwan

Taipei Nangang Exhibition Center, September 7-9, 2016 – SEMICON Taiwan 2016. PiBond participates in SEMICON Taiwan event in Taipei at the Grand Trend booth No....

March 10, 2016

PiBond materials for MEMS, TSV and IC fabrication at SEMICON China

Shanghai New International Expo Centre, March 15-17, 2016 – SEMICON China 2016. PiBond participates in SEMICON China event in Shanghai at the Nagase booth No....

January 01, 2016

PiBond Advanced Materials for Optical Sensors, MEMS and IC Packaging at NEPCON in Japan

Tokyo Big Sight, January 13-15, 2016 – Nepcon Japan 2016. PiBond participates in the NEPCON conference at Nagase booths E52-40 (Hall 6) and E21-13 (Hall...

April 01, 2015

As Semicon Fabs Eye Solutions for Moore's Law Extension, Pibond Introduces a New Product Line for Logic, Memory, Power and MEMS Devices

New spin-on hardmask materials -- SAP-100 product line -- enables most advanced semiconductor nodes as well as process simplifications HELSINKI, Finland, April 1, 2015 --...

July 29, 2014

Pibond Oy announced its acquisition of the assets of Silecs Oy

Helsinki, Finland July 29, 2014 - Pibond Oy, a speciality chemical investment vehicle, today announced its acquisition of the assets of Silecs Oy (www.Silecs.com)....

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