The SG series methylsiloxane dielectrics provide an unparalleled quality and consistency. SG-Series products are high quality, robust, and crack-free spin-on dielectrics designed to meet planarizing requirements for partial (for IMD) and total etch back (for PMD) processes planarization processes found in both BEOL and FEOL applications. SG-Series has superior gap fill performance and compatible for devices with narrow (down to 0.1µm) high AR (up to 7:1) patterned features. PiBond’s Silecs® SG series are currently produced in the three sub-series: SG 200, SG 300 and SG 400.
We also offer advanced uLK dielectrics and ultra-conformal dielectrics for next generation IC’s FEOL and BEOL requirements.
|Dielectric constant||Refractive index @ 633nm||Crack threshold, single coat (nm)|