PiBond’s materials are used in optical and MEMS sensors as clear and colorless optical dielectrics and enabling process hard masks. Our materials have served handheld devices for nearly a decade.
Our materials with an industry leading range of indexes of refraction – from high to low refractive index – attract interest in sensor and a myriad of other optoelectronic applications. Your MEMS sensors and processes may find use of our metal oxide hard masks in miniaturization schemes and etch processes. The materials have outstanding selectivity in aggressive fluorine based dry etch chemistries used in formation of MEMS devices, or deep silicon vias in 3D integration. Miniaturization is achieved by improved CD control and smaller feature sizes which currently used materials cannot enable.
The metal oxide chemistries provide unparalleled protection to substrate etch applications where aspect ratio is the key for success
Siloxane materials exhibiting industry leading range of refractive indexes and outstanding optical clarity
Optical dielectric layers are embedded in many devices we use today. The most obvious may be the many flat screen devices we use on a daily basis. However, optical dielectrics can also be found in image sensors in our cameras, solar panels any other screen we may look at home or at work.
PiBond SC products contain a wide variety of materials with different properties and process options for integration in manufacturing of latest gadgets.
Three-dimensional integrated circuit (3D IC) is an integrated circuit made by stacking dies and interconnecting these vertically using through-silicon vias (TSVs). In this way, they behave as a single device and may achieve additional performance improvements such as reduced power and smaller footprint than conventional two dimensional processes.
Our SAP hard mask products simplify the process at lower cost of ownership.
SG products have been used for decades and find increasing use in new applications. SG products are predominately used as inter layer dielectrics in integrated circuits.
The materials are coated on substrates where these fill narrow gaps and the excess material is either totally (ILD) or partially (PMD) removed by an etch process.