四月 01, 2015

As Semicon Fabs Eye Solutions for Moore's Law Extension, Pibond Introduces a New Product Line for Logic, Memory, Power and MEMS Devices

New spin-on hardmask materials -- SAP-100 product line -- enables most advanced semiconductor nodes as well as process simplifications

HELSINKI, Finland, April 1, 2015 -- Pibond Oy, a specialty chemical manufacturer of advanced semiconductor solutions, today introduced its new product line of liquid spin-on metal oxide hardmask materials. Targeting 10nm node semiconductor processing, 3D NAND, power ICs as well as MEMS applications, this technology enables advanced device manufacturing through reduced cost of ownership (COO) and simplified processing.

With the ever-increasing demand for increased functionality in applications from personal computing to mobile to cloud storage to wearables, the semiconductor industry is targeting smaller and smaller nodes and in so doing has lived up to Gordon Moore's prediction. However, the limits of current lithography processes and the uncertainty surrounding next generation approaches, compounded by their costs, have cast doubt on whether Moore's law has finally run 'out of steam.'

Pibond's breakthrough materials are designed to bridge this gap, providing continuity for existing high- end fabs, while maintaining compatibility for future technology roadmaps. These novel polymers represent the next generation of liquid spin-on hard mask products and are suitable for advanced lithographic patterning, 2.5/3D-IC packaging, as well as MEMS processing.

SAP-100 Product Line: A new solution for advanced lithography patterning of logic and power devices and high selectivity etching for 3D NAND and MEMS

Pibond's SAP 100 product line is based on patent pending organo-siloxane modified spin-on metal oxide thin films that are compatible with advanced photoresist lithography and other semiconductor etch processes. The product line offers tunable optical (n&k) properties matching critical requirements of advanced lithography. Furthermore, it shows extraordinary etch resistance in plasma etching processes even at very low film thicknesses. Unlike most conventional hard masks, the Pibond SAP hard mask is applied with low cost spin-on track equipment, enabling high throughput and lowering the overall COO. Importantly, it can be applied with process equipment common in both state-of-the-art and legacy fabs, thus eliminating the need for new and potentially capital-intensive equipment. Future product releases in the SAP-100 family will be directly photopatternable further decreasing process complexity and COO.

"As process throughput and the demand for ever increasing device performance continue to challenge the semiconductor industry, we are happy to announce this new class of products based on advanced metal oxide and siloxane polymers. Capable of extending the runway for existing lithography tools and processes, thereby lowering the operating costs of current and future fabs, they are also paving the way for the future as new technologies like EUV mature," said Jonathan Glen, Chairman of Pibond. "As the industry demands new materials to meet the needs of EUV lithography, 3D memory, power ICs, image sensors, TSV and MEMS applications, Pibond is well placed to be a driving force in this transition."

About Pibond
Pibond is a leader in the development and production of advanced liquid spin-on materials. With the acquisition of Silecs technology and state-of-the-art production plant, Pibond has a proven track record of materials innovation and manufacturing for the semiconductor industry. Pibond products are key contributors in the production of the latest ultra-high resolution semiconductor devices used in mobile devices, electric vehicles and wearables. A global provider with a proven and audited track record of producing and monitoring specialty chemicals at ultra-high purity levels (e.g. impurities are at parts-per-trillion levels), Pibond's Helsinki facility meets the standards for reliability and high quality demanded by the semiconductor industry. Please visit us at www.silecs.com.

Contact:
Pibond Oy
Kutojantie 2 B 02630 Espoo, Finland
Info@silecs.com



返回上一页

所有新闻

八月 19, 2019

PiBond在‘国际先进光刻技术研讨会’

PiBond在‘国际先进光刻技术研讨会’,2019年10月17-18日,中国南京 PiBond在国际先进光刻技术研讨会(IWAPS 2019)上报告“为先进和新型半导体制造工艺提供的硅基材料”。 有机化学放大光刻胶(CAR)已经为该行业服务了数十年。随着工业向最后的鳍式场效应晶体管(FinFET)工艺节点发展,由于在极紫外光刻(EUVL)图形化中的分辨率和线宽粗糙度限制,这些材料可能需要更换。因此,无机材料被认为是EUVL有机CAR光刻胶的可行替代品,并且近年来受到越来越多的关注。基于对新材料和工艺的需求,PiBond开发了一种新型硅基EUVL光刻胶,并将材料技术扩展到其他光刻波长,从而为提高产量和整体工艺改进提供了方法。报告将讨论和总结硅基光刻胶和光刻辅助层的最新成果。 IWAPS为来自全球半导体工业界、学术界的资深技术专家和优秀研究人员等提供一个技术交流平台,参会者可以就材料、设备、工艺、测量、计算光刻和设计优化等主题分享各自的研究成果,探讨图形化解决方案,研讨即将面临的技术挑战。作为中国首个高端光刻技术研讨会,其发言者均为特邀自光刻及其相关领域的国内外资深专家,代表了其所在领域的国际先进水平。报告内容涉及广泛,涵盖了当前的技术现状、未来的发展趋势以及面临的挑战等。该研讨会旨在为与会者提供一个深入讨论的互动平台,也为想要了解更多全球半导体业界动态的研究者和工程师提供更多机会。 PiBond欢迎全体感兴趣的专家人员与会讨论。

八月 19, 2019

PiBond在2019台湾国际半导体展展出

台北南港展览馆,2019年9月18-20日 PiBond在台湾台北举行的国际半导体展展出。展位号N0484 (4楼)。PiBond展示所有产品线的产品。 我们欢迎所有与会者参观我们、进一步了解我们的可旋涂介电材料和图案转移产品。

二月 21, 2019

PiBond在2019中国(上海)国际半导体展展出

上海新国际博览中心,2019年3月20-22日 PiBond将参加在上海举办的国际半导体展活动。 您可以在1737号展台找到我们。PiBond将展出EUV光刻胶、可旋涂介质材料和光刻产品。 我们欢迎所有与会者访问我们,了解我们的产品。

八月 03, 2018

PiBond在2018台湾国际半导体展展出

台北南港展览馆1楼&4楼,2018年9月5-7日 – 2018台湾国际半导体展 PiBond在台湾台北举行的国际半导体展展出。展位号I2222号 (1楼)。 PiBond展示所有产品线的产品。 我们欢迎所有与会者参观我们,了解我们的可旋涂电介质和图案转移产品。

二月 23, 2018

PiBond 将在SEMICON China 2018展出

上海新国际博览中心,2018年3月14日 – 16日 PiBond将在上海的SEMICON China展览会展出。我们将分别在靖洋集团的N1展厅1677号展位和PacTech-Packaging Technologies的N2展厅2409号展位展示所有产品线的产品。 我们欢迎所有与会者参观我们,并进一步了解我们的旋涂电介质和图案转移材料。

八月 18, 2017

PiBond 在2017 SEMICON台湾展出

台北南港展览馆,2017年9月13日至15日 - SEMICON台湾2017。   PiBond参加台湾台北的SEMICON台湾盛会。 您可以在2228号(1楼)和5号(4楼)展位找到我们。PiBond展示所有产品线的产品。 我们欢迎所有与会者参观我们,并进一步了解我们的旋涂电介质和图案转移材料。

五月 12, 2017

PiBond在SEMICON Europa

德国慕尼黑,2017年11月14日-17日 PiBond将参加在德国慕尼黑举办的欧洲国际半导体设备展览会SEMICON Europa。 今年的SEMICON Europa将与国际电子生产设备博览会productronica共同举办。 我们将在B1馆1028号展位展出。  

二月 20, 2017

PiBond exhibits at SEMICON China 2017

Shanghai New International Expo Centre, March 14-16, 2017. PiBond participates in SEMICON China event in Shanghai at the Nagase booth No. 5617 in hall W5....

十月 25, 2016

PiBond materials for MEMS, TSV and IC fabrication at SEMICON Europa

Alpexpo, Grenoble, October 25-27, 2016 – SEMICON Europa. PiBond participates in SEMICON Europa event in Grenoble, France. Our booth No. is 541. We exhibit our...

十月 19, 2016

PiBond pioneers a new material approach for MEMS and 3D IC manufacturing.

Pibond is awarded patent for its SAP technology platform.   Helsinki, Oct. 19, 2016 — PiBond today announced the latest key milestone in its innovative SAP...

九月 22, 2016

New materials with high refractive index for optical applications

Rapidly emerging global megatrends such as Internet of Things, augmented reality as well as new waves of automotive and security related applications have become key...

九月 07, 2016

PiBond materials for MEMS, TSV and IC fabrication at SEMICON Taiwan

Taipei Nangang Exhibition Center, September 7-9, 2016 – SEMICON Taiwan 2016. PiBond participates in SEMICON Taiwan event in Taipei at the Grand Trend booth No....

三月 10, 2016

PiBond materials for MEMS, TSV and IC fabrication at SEMICON China

Shanghai New International Expo Centre, March 15-17, 2016 – SEMICON China 2016. PiBond participates in SEMICON China event in Shanghai at the Nagase booth No....

一月 01, 2016

PiBond Advanced Materials for Optical Sensors, MEMS and IC Packaging at NEPCON in Japan

Tokyo Big Sight, January 13-15, 2016 – Nepcon Japan 2016. PiBond participates in the NEPCON conference at Nagase booths E52-40 (Hall 6) and E21-13 (Hall...

四月 01, 2015

As Semicon Fabs Eye Solutions for Moore's Law Extension, Pibond Introduces a New Product Line for Logic, Memory, Power and MEMS Devices

New spin-on hardmask materials -- SAP-100 product line -- enables most advanced semiconductor nodes as well as process simplifications HELSINKI, Finland, April 1, 2015 --...

七月 29, 2014

Pibond Oy announced its acquisition of the assets of Silecs Oy

Helsinki, Finland July 29, 2014 - Pibond Oy, a speciality chemical investment vehicle, today announced its acquisition of the assets of Silecs Oy (www.Silecs.com)....

联系我们

感谢您联系我们!