Rapidly emerging global megatrends such as Internet of Things, augmented reality as well as new waves of automotive and security related applications have become key factors in an increasing demand for imaging sensors. The growing number of different applications place new requirements for materials within these sensors which are based on integrated semiconductor optical devices and systems. These are sensors similar to those traditionally found in mobile phones and other hand-held devices. Tailored materials with outstanding optical clarity, reliability and variable indexes of refraction are needed to improve the performance these specialized devices.
PiBond has supplied materials to this ever-growing segment of integrated circuit sensors for a decade. Now, the semiconductor material specialist and siloxanes pioneer adds more novel optical dielectrics to its extensive siloxane IP portfolio. PiBond’s new and existing materials reach new boundaries in optical properties, particularly the index of refraction. A recently awarded patent describes materials enabling significant increase and control of key optical constants: the refractive index and extinction coefficient, optical transmission – while still retaining excellent dielectric performance and solid environmental robustness. These are properties are essential for device and process design factors fabless designers, IMD and OEM brand owners in semiconductor optoelectronics industry.
PiBond’s molecularly designed organo-silane and siloxane polymers have found many commercial uses in advanced semiconductor devices such as smartphone imaging sensors, quantum dot displays as well in the most advanced lithography processes. PiBond doesn’t only design and develop ultra-novel materials for the semiconductor world, but also has state-of-the-art capabilities to manufacture the same. It’s factory in Espoo, Finland yields specialty siloxane and metal oxide polymers with one of the highest purities in the industry. The patent has been issued by the US Patent and Trademark Office with the number US 9,190,616.
"We are excited about the latest addition to our optical dielectric IP portfolio. Our invention sets a new record for high refractive index optical dielectrics at 1.70. This is ground breaking as we have done this without the addition of index boosting nanoparticles. We are confident that the users will receive a positive response from clients, in particular as the material behaves much in the same way as the high RI siloxanes that we have been supplying the industry for a decade," said Jonathan Glen, Chairman of PiBond. "As the industry demands new materials to meet the needs of EUV lithography, 3D memory, power ICs, image sensors, TSV and MEMS applications, PiBond is well placed to be a driving force in this transition."
Figure: Examples of refractive index that PiBond’s materials exhibit.
上海新国际博览中心，2019年3月20-22日 PiBond将参加在上海举办的国际半导体展活动。 您可以在1737号展台找到我们。PiBond将展出EUV光刻胶、可旋涂介质材料和光刻产品。 我们欢迎所有与会者访问我们，了解我们的产品。八月 03, 2018
台北南港展览馆1楼&4楼，2018年9月5-7日 – 2018台湾国际半导体展 PiBond在台湾台北举行的国际半导体展展出。展位号I2222号 (1楼)。 PiBond展示所有产品线的产品。 我们欢迎所有与会者参观我们，了解我们的可旋涂电介质和图案转移产品。二月 23, 2018
上海新国际博览中心，2018年3月14日 – 16日 PiBond将在上海的SEMICON China展览会展出。我们将分别在靖洋集团的N1展厅1677号展位和PacTech-Packaging Technologies的N2展厅2409号展位展示所有产品线的产品。 我们欢迎所有与会者参观我们，并进一步了解我们的旋涂电介质和图案转移材料。八月 18, 2017
台北南港展览馆，2017年9月13日至15日 - SEMICON台湾2017。 PiBond参加台湾台北的SEMICON台湾盛会。 您可以在2228号（1楼）和5号（4楼）展位找到我们。PiBond展示所有产品线的产品。 我们欢迎所有与会者参观我们，并进一步了解我们的旋涂电介质和图案转移材料。五月 12, 2017
德国慕尼黑，2017年11月14日-17日 PiBond将参加在德国慕尼黑举办的欧洲国际半导体设备展览会SEMICON Europa。 今年的SEMICON Europa将与国际电子生产设备博览会productronica共同举办。 我们将在B1馆1028号展位展出。二月 20, 2017
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