Pibond is awarded patent for its SAP technology platform.
Helsinki, Oct. 19, 2016 — PiBond today announced the latest key milestone in its innovative SAP platform. SAP’s metal oxide solution revolutionizes the way in which manufacturers deal with ever increasing cost structures resulting from more complex designs. These materials boast higher etch selectivity than anything currently on the market - thus enabling patterning architectures previously unavailable with conventional techniques.
“The SAP platform is a breakthrough in the way manufacturers can deal with ever growing challenges faced by the semiconductor industry,” said Jonathan Glen, Chairman and Managing Director of Pibond. “It is a simple solution to the current road block that is holding back the development of a new generations of devices demanded by the market.”
The material developed by PiBond has the ability to withstand variable aggressive reactive ion etch conditions. The patent granted materials boast etch selectivity to silicon that exceeds 100 000:1 - improving the control of critical dimensions, and enabling patterning architectures previously unachievable with conventional techniques. The SAP products are easy-to-apply and easy-to-remove spin coated materials which can be processed using existing coating infrastructure.
As well as working as normal hard-masks, SAP’s photo-patterned metal oxide materials are expected to revolutionize pattern and etch cost structures by the elimination of cumbersome thick photoresists as well as costly and slow plasma vapor deposition tools. With a photo-patterned SAP product PiBond anticipates to reduce costs considerably. “We believe this material platform will fundamentally change how our users approach patterning these demanding architectures” adds Dr. Thomas Gädda, Director at PiBond.
SAP products are anticipated to become the go-to material not only in the MEMS industry but also in DRAM memory capacitor trench generations and 3D IC through silicon via (TSV) patterning and in particular the System-on-Package Backside Illuminated CMOS image sensor.
上海新国际博览中心，2019年3月20-22日 PiBond将参加在上海举办的国际半导体展活动。 您可以在1737号展台找到我们。PiBond将展出EUV光刻胶、可旋涂介质材料和光刻产品。 我们欢迎所有与会者访问我们，了解我们的产品。八月 03, 2018
台北南港展览馆1楼&4楼，2018年9月5-7日 – 2018台湾国际半导体展 PiBond在台湾台北举行的国际半导体展展出。展位号I2222号 (1楼)。 PiBond展示所有产品线的产品。 我们欢迎所有与会者参观我们，了解我们的可旋涂电介质和图案转移产品。二月 23, 2018
上海新国际博览中心，2018年3月14日 – 16日 PiBond将在上海的SEMICON China展览会展出。我们将分别在靖洋集团的N1展厅1677号展位和PacTech-Packaging Technologies的N2展厅2409号展位展示所有产品线的产品。 我们欢迎所有与会者参观我们，并进一步了解我们的旋涂电介质和图案转移材料。八月 18, 2017
台北南港展览馆，2017年9月13日至15日 - SEMICON台湾2017。 PiBond参加台湾台北的SEMICON台湾盛会。 您可以在2228号（1楼）和5号（4楼）展位找到我们。PiBond展示所有产品线的产品。 我们欢迎所有与会者参观我们，并进一步了解我们的旋涂电介质和图案转移材料。五月 12, 2017
德国慕尼黑，2017年11月14日-17日 PiBond将参加在德国慕尼黑举办的欧洲国际半导体设备展览会SEMICON Europa。 今年的SEMICON Europa将与国际电子生产设备博览会productronica共同举办。 我们将在B1馆1028号展位展出。二月 20, 2017
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Pibond is awarded patent for its SAP technology platform. Helsinki, Oct. 19, 2016 — PiBond today announced the latest key milestone in its innovative SAP...九月 22, 2016
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