集成电路

集成电路的发展由固定区域中的电路致密化程度决定。因此,近期越来越精细的特征和集成电路的三维垂直整合促进了行业的进一步发展。

Pibond生产用于最先进节点的光刻辅助材料,并提供可以简化三维集成电路工艺步数的辅助层材料。除了光刻图案化工艺中的牺牲层材料,我们还生产各种介电材料和使能硬掩模材料。我们的硅基涂层材料非常有益于准分子激光KrF和ArF(248和193nm)图案化。目前我们正在为未来的光刻工艺准备新的材料。卓越的制造技术使得我们能够把痕量金属总量控制在5ppb以下,这是制造最先进工艺节点的先决条件。

我们的后段制程介电材料在可靠性和成本效益优势方面为行业树立了新标杆。

3D IC

Moore’s law has required an ever increasing number of transistors per die on a constant footprint. As the linewidths of lithographic patterning is approaching theoretical limits, the only way to increase transistor count is to construct circuitries in stacks. Three-dimensional integrated circuit (3D IC) is an integrated circuit made by stacking dies and interconnecting these vertically using through-silicon vias (TSVs). In this way, they behave as a single device and may achieve additional performance improvements such as reduced power and smaller footprint than conventional two dimensional processes. Our SAP hard mask products simplify the process at lower cost of ownership.

Lithography

Successful patterning of photoresist and subsequent pattern transfer to form integrated circuits require auxiliary layers. These layers address challenges in pattern formation arising from topographical changes on the wafer, and provide selectivity during etch processes which transfer the pattern to the substrate.

PiBond manufactures SH siloxane products to provide anti-reflective layers and sacrificial hard masks for advanced patterning processes. 

ULK and BEOL dielectrics

SG products have been used for decades and find increasing use in new applications. SG products are predominately used as inter layer dielectrics in integrated circuits.

The materials are coated on substrates where these fill narrow gaps and the excess material is either totally (ILD) or partially (PMD) removed by an etch process.

Photodielectrics

Our products under development include photodefinable siloxane dielectrics. These find a number of uses, such as a redistribution layer in wafer level packaging. These will be launched as our products meet the strict, ambitious specifications we have set for them.

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