传感器

传感器无处不在——触摸、振动、光学、温度——这些传感器的应用日增一日。

PiBond的材料,作为透明无色的光电介质和使能工艺材料,应用于光学传感器和微机电系统传感器中。我们的材料已经服务手持设备近十年。

我们的材料具有行业领先的折射率范围,高低均有。这吸引了传感器及无数其它光电应用的兴趣。我们的金属氧化物硬掩模材料极可能在您的MEMS传感器小型化和蚀刻过程中发挥可观的效用。

Optical dielectrics

Optical dielectric layers are embedded in many devices we use today. The most obvious may be the many flat screen devices we use on a daily basis. However, optical dielectrics can also be found in image sensors in our cameras, solar panels any other screen we may look at home or at work.

PiBond SC products contain a wide variety of materials with different properties and process options for integration in manufacturing of latest gadgets.

Etch hard mask

Three-dimensional integrated circuit (3D IC) is an integrated circuit made by stacking dies and interconnecting these vertically using through-silicon vias (TSVs). In this way, they behave as a single device and may achieve additional performance improvements such as reduced power and smaller footprint than conventional two dimensional processes.

Our SAP hard mask products simplify the process at lower cost of ownership.

Spin-on dielectrics

SG products have been used for decades and find increasing use in new applications. SG products are predominately used as inter layer dielectrics in integrated circuits.

The materials are coated on substrates where these fill narrow gaps and the excess material is either totally (ILD) or partially (PMD) removed by an etch process.

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