PiBond Ltd, a leading manufacturer of advanced materials for the semiconductor industry, and Paul Scherrer Institute PSI, the largest research institute for natural and engineering sciences in Switzerland, have signed a technology licensing agreement and strategic collaboration to advance the development of next-generation lithographic materials and drive future semiconductor innovation.

Lithography has been a cornerstone in driving over five decades of unprecedented advancements in semiconductor technology, playing a pivotal role in the next generation of semiconductor integrated circuits. This process technology, particularly in its most advanced form – extreme ultraviolet lithography or EUV – stands as the paragon of ultra-high-precision manufacturing. It is instrumental in fabricating semiconductor chips that are not only faster but also more energy-efficient, fuelling the rapid evolution of artificial intelligence. Currently, development is hampered by limitations in lithographic materials. PiBond is at the forefront, addressing these challenges.

The aim of this strategic collaboration between PiBond and PSI is to commercialise and deploy novel resist technology in the most advanced semiconductor device manufacturing, and to demonstrate the potential of academic research to drive commercial device innovation.

In addition, this collaboration will pave the way for significant advances in semiconductor technology, providing solutions to pressing industry needs and opening new opportunities for future development.

As part of this agreement, PiBond has established a subsidiary in Switzerland (at Switzerland Innovation Park Innovaare) to further deepen its collaboration with PSI and its research infrastructure. In addition, PiBond has licensed and will continue to develop advanced lithography technologies based on innovations created at PSI.

Thomas Gädda, Chief Technology Officer at PiBond, said: "The next generation, high NA EUV scanners by ASML are being installed in the industry. Materials which we have developed have demonstrated improvements in EUV lithography processes – both as resist and underlayers. Our partnership with PSI, a longstanding, leading institute in the field, is important. This collaboration has and will continue to contribute to our progress in material and process development for future fabrication processes needed to build next generation semiconductor devices."

Meanwhile Yasin Ekinci, Head of the Laboratory for X-ray Nanoscience and Technologies at the Paul Scherrer Institute PSI, added: "The cooperation with PiBond is valuable and promising for PSI and brings many opportunities for further development of the mentioned technology in a continued collaboration with PiBond."

“The agreement not only strengthens PiBond's development capabilities, but also expresses the value of successful technology transfer of research results to industry and the market. This demonstrates the company's commitment to innovation and staying at the forefront of technological advancements, commented Pasi Leinonen, Senior Director Sales & Marketing at PiBond.

For media inquiries, please contact PiBond:

Pasi Leinonen, Senior Director, Sales & Marketing

+358405094066

pasi.leinonen@pibond.com

For media inquiries, please contact PSI:

Dr. Yasin Ekinci

Leiter des Labors Röntgen-Nanowissenschaften und Technologien

Paul Scherrer Institut, Forschungsstrasse 111, 5232 Villigen PSI, Schweiz

+41 56 310 28 24

yasin.ekinci@psi.ch

PiBond, a leading specialty chemical manufacturer serving the semiconductor industry, is set to undergo a substantial expansion of its current facility in Espoo, Finland, to enhance lithography product production. The capacity expansion, scheduled for 2024, is expected to lead to a 50% increase in production capacity, positioning PiBond to meet rising demand and significantly boost sales in the semiconductor industry in the coming years.

The expansion targets the growing market demand for lithography products, supporting the volume production needed for microprocessors, memory chips, sensors, and displays. PiBond's commitment to ultra-purity involves separating the manufacturing processes for silicon and carbon-based products, aligning with the highest industry standards.

Pasi Leinonen, Senior Director of Sales and Marketing at PiBond, stated: "With this strategic investment, PiBond is poised to play a crucial role in meeting the increasing demand for lithography products in the semiconductor industry. We are dedicated to advancing technology and supporting our customers with high-value specialty materials."

The expanded facility not only strengthens PiBond's production capabilities but also facilitates the implementation of new manufacturing processes on a larger scale, showcasing the company's commitment to innovation and staying at the forefront of technological advancements.

Leinonen added: "This expansion marks a new chapter in PiBond's growth story, solidifying its position as a leading supplier of high-value specialty materials in a rapidly growing and evolving industry."

In a global semiconductor market projected to reach $624 billion this year (Gartner) and expected to double to $1300 billion within this decade, PiBond stands out as an innovative force.

For media inquiries, please contact:

Pasi Leinonen, Senior Director, Sales & Marketing

+358405094066

pasi.leinonen@pibond.com

PiBond participates in SEMICON Taiwan event September 6-8, 2023. “Advanced silicon-based materials enabling new solutions for device fabrication” will be presented by PiBond at TechXPOT on September 6. Make sure to visit us at booth L0421 (Taipei Nangang Exhibition Center, Hall 1, 4F).