HELSINKI, Finland, April 1, 2015 -- Pibond Oy, a specialty chemical manufacturer of advanced semiconductor solutions, today introduced its new product line of liquid spin-on metal oxide hardmask materials. Targeting 10nm node semiconductor processing, 3D NAND, power ICs as well as MEMS applications, this technology enables advanced device manufacturing through reduced cost of ownership (COO) and simplified processing.
With the ever-increasing demand for increased functionality in applications from personal computing to mobile to cloud storage to wearables, the semiconductor industry is targeting smaller and smaller nodes and in so doing has lived up to Gordon Moore's prediction. However, the limits of current lithography processes and the uncertainty surrounding next generation approaches, compounded by their costs, have cast doubt on whether Moore's law has finally run 'out of steam.'
Pibond's breakthrough materials are designed to bridge this gap, providing continuity for existing high- end fabs, while maintaining compatibility for future technology roadmaps. These novel polymers represent the next generation of liquid spin-on hard mask products and are suitable for advanced lithographic patterning, 2.5/3D-IC packaging, as well as MEMS processing.
SAP-100 Product Line: A new solution for advanced lithography patterning of logic and power devices and high selectivity etching for 3D NAND and MEMS
Pibond's SAP 100 product line is based on patent pending organo-siloxane modified spin-on metal oxide thin films that are compatible with advanced photoresist lithography and other semiconductor etch processes. The product line offers tunable optical (n&k) properties matching critical requirements of advanced lithography. Furthermore, it shows extraordinary etch resistance in plasma etching processes even at very low film thicknesses. Unlike most conventional hard masks, the Pibond SAP hard mask is applied with low cost spin-on track equipment, enabling high throughput and lowering the overall COO. Importantly, it can be applied with process equipment common in both state-of-the-art and legacy fabs, thus eliminating the need for new and potentially capital-intensive equipment. Future product releases in the SAP-100 family will be directly photopatternable further decreasing process complexity and COO.
"As process throughput and the demand for ever increasing device performance continue to challenge the semiconductor industry, we are happy to announce this new class of products based on advanced metal oxide and siloxane polymers. Capable of extending the runway for existing lithography tools and processes, thereby lowering the operating costs of current and future fabs, they are also paving the way for the future as new technologies like EUV mature," said Jonathan Glen, Chairman of Pibond. "As the industry demands new materials to meet the needs of EUV lithography, 3D memory, power ICs, image sensors, TSV and MEMS applications, Pibond is well placed to be a driving force in this transition."
Pibond is a leader in the development and production of advanced liquid spin-on materials. With the acquisition of Silecs technology and state-of-the-art production plant, Pibond has a proven track record of materials innovation and manufacturing for the semiconductor industry. Pibond products are key contributors in the production of the latest ultra-high resolution semiconductor devices used in mobile devices, electric vehicles and wearables. A global provider with a proven and audited track record of producing and monitoring specialty chemicals at ultra-high purity levels (e.g. impurities are at parts-per-trillion levels), Pibond's Helsinki facility meets the standards for reliability and high quality demanded by the semiconductor industry. Please visit us at www.silecs.com.
Kutojantie 2 B 02630 Espoo, Finland
PiBond products manage photons in the most advanced semiconductor manufacturing processes and devices. Now PiBond shares its advanced semiconductor process expertise and unique materials to build photonics...April 07, 2022
Come and explore our OptiClear materials for optical bonding of future display applications! We manufacture silicone optically clear resins #OCR, optical films and optical coatings...April 07, 2022
PiBond participates in Touch Taiwan in Taipei April 27-29. We welcome all conference participants to visit us at our booth N221 to learn about...January 21, 2022
Come and explore the most advanced photonics materials and processes SPIE Photonics West 2022 Emerging flat optics like #metasurfaces and other photonics devices are using the latest semiconductor...December 14, 2021
PiBond participates in SEMICON Taiwan event in Taipei December 28-30. We welcome all conference participants to visit us at our booth N0284 to learn...October 20, 2021
PiBond participates in IWAPS in Foshan China with two posters outlining recent progress in silicon-based photoresist technology. PiBond is working to develop a suite of...September 29, 2021
PiBond launches its new product platform complex, free-form displays. The first product in the platform is OptiClear – a high refractive index silicone adhesive....June 02, 2021
PiBond is proud to announce that we have joined to Responsible Care program. Program’s goal is to improve safety and reduce environmental impact of...May 03, 2021
To enhance the service to the chip makers and meet the strong demand from Taiwan Market. PiBond has opened the branch in Hsinchu to...March 29, 2021
PiBond's materials are applied in tens of thousands monthly wafer starts in the manufacturing semiconductor devices. Many of the materials applied have an optical...March 02, 2021
PiBond participates in SEMICON China event in Shanghai, March 17-19, 2021. You can find us at the booth E7 7775. PiBond will exhibit spin coatable...November 19, 2020
The victory comes in the Category of Business Innovations on PiBond’s Silicon-Rich Materials for Advanced Semiconductor Fabrication. The Awarded innovation represents the latest technology...October 22, 2020
Whereas we have been a technology leading company in the semiconductor siloxane materials space for some years already. Now we have also made great...September 16, 2020
PiBond at IWAPS, 5-6 November 2020, Chengdu China PiBond presents ‘New silicon-based materials for semiconductor manufacturing processes’ at ‘International Workshop on Advanced Patterning Solutions’ (IWAPS...September 10, 2020
SEMICON Taiwan, September 23-25, Hall 1 (TaiNEX 1) PiBond participates in SEMICON Taiwan event in Taipei, Taiwan. You can find us at booth N0384. PiBond...March 26, 2020
Statement from us regarding the situation with currently ongoing COVID-19 pandemic. PiBond's statementAugust 19, 2019
PiBond at IWAPS, 17-18. October 2019, Nanjing, China PiBond presents ‘Enabling silicon-based materials for advanced and novel semiconductor manufacturing processes’ at ‘International Workshop on Advanced...August 19, 2019
TWTC Nangang Hall, September 18-20, 2019 PiBond participates in SEMICON Taiwan event in Taipei, Taiwan. You can find us at booth N0484 (4th floor). PiBond...February 21, 2019
Shanghai New International Expo Centre, March 20-22, 2019. PiBond will participate in SEMICON China event in Shanghai. You can find us at the booth 1737....August 03, 2018
Taipei Nangang Exhibition Center 1&4F, September 5-7, 2018 – SEMICON Taiwan 2018. PiBond participates in SEMICON Taiwan event in Taipei, Taiwan. You can find us...February 27, 2018
Thermal scanning probe lithography (tSPL) has been used to create patterns with sub-20 nm half pitch resolution. Pattern generation uses a thermally sensitive resist...February 23, 2018
Shanghai New International Expo Centre, March 14-16, 2018 PiBond will participate in SEMICON China event in Shanghai. You can find us at the Genes Tech...August 17, 2017
Taipei Nangang Exhibition Center, September 13-15, 2017 – SEMICON Taiwan 2017. PiBond participates in SEMICON Taiwan event in Taipei, Taiwan. You can find us at...May 12, 2017
Munich, Germany, November 14-17, 2017. PiBond participates in SEMICON Europa event in Munich, Germany. This year’s SEMICON Europa event will be co-located with productronica, the...February 20, 2017
Shanghai New International Expo Centre, March 14-16, 2017. PiBond participates in SEMICON China event in Shanghai at the Nagase booth No. 5617 in hall W5....October 25, 2016
Alpexpo, Grenoble, October 25-27, 2016 – SEMICON Europa. PiBond participates in SEMICON Europa event in Grenoble, France. Our booth No. is 541. We exhibit our...October 19, 2016
Pibond is awarded patent for its SAP technology platform. Helsinki, Oct. 19, 2016 — PiBond today announced the latest key milestone in its innovative SAP...September 22, 2016
Rapidly emerging global megatrends such as Internet of Things, augmented reality as well as new waves of automotive and security related applications have become key...September 07, 2016
Taipei Nangang Exhibition Center, September 7-9, 2016 – SEMICON Taiwan 2016. PiBond participates in SEMICON Taiwan event in Taipei at the Grand Trend booth No....March 10, 2016
Shanghai New International Expo Centre, March 15-17, 2016 – SEMICON China 2016. PiBond participates in SEMICON China event in Shanghai at the Nagase booth No....