PiBond presents ‘New silicon-based materials for semiconductor manufacturing processes’ at ‘International Workshop on Advanced Patterning Solutions’ (IWAPS 2020).
PiBond manufactures silicon-based materials and planarizing organic polymers primarily for the semiconductor industry. The materials are used in lithography as resists or underlayers, in dielectric applications, and in optoelectronic applications to maximize device performance. PiBond has developed novel silicon-based resist materials that can be patterned in high resolution. A range of materials has been developed for the use in two main applications: as a directly patternable hard mask (middle layer), and as a directly patternable dielectric. In both applications, throughput can be increased, and cost of operation can be reduced. Recent achievements in the area of silicon-based resist materials, and lithography stack development will be discussed and summarized. In addition, outlines of recent material development for other applications will be reviewed.
IWAPS provides a forum for the experts from industry and research institutions worldwide to present and discuss advanced pattering solutions and related challenges such as material, equipment, process, metrology, computational lithography and design optimization. The speakers at the workshop are selected by invitation only and represent a broad range of disciplines and covering a wide array of different lithography approaches and requirements. Presentations are arranged to be comprehensive, covering the current practice, the future trends and the challenges ahead. The workshop is intended to provide a platform for attendees from international and domestic institutions to interact and discuss some common challenges faced by the industry. It will also be an opportunity for people to learn more about the semiconductor R&D and business landscape in China.
PiBond welcomes everyone interested to discuss at IWAPS.
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