PiBond participates in SEMICON China event in Shanghai at the Nagase booth No. 9 at the location N5-538. We exhibit our SAP product solutions for TSV fabrication, MEMS manufacturing as well as IC packaging. Similarly, our optical dielectrics are showcased. We welcome all conference participants, and particularly exhibitors and visitors and IC manufacturing pavilions, to visit us and Nagase to learn of new material solutions which can improve processes and simultaneously decrease cost of ownership.
The products featured are:
Taipei Nangang Exhibition Center 1&4F, September 5-7, 2018 – SEMICON Taiwan 2018. PiBond participates in SEMICON Taiwan event in Taipei, Taiwan. You can find us...February 27, 2018
Thermal scanning probe lithography (tSPL) has been used to create patterns with sub-20 nm half pitch resolution. Pattern generation uses a thermally sensitive resist...February 23, 2018
Shanghai New International Expo Centre, March 14-16, 2018 PiBond will participate in SEMICON China event in Shanghai. You can find us at the Genes Tech...August 17, 2017
Taipei Nangang Exhibition Center, September 13-15, 2017 – SEMICON Taiwan 2017. PiBond participates in SEMICON Taiwan event in Taipei, Taiwan. You can find us at...May 12, 2017
Munich, Germany, November 14-17, 2017. PiBond participates in SEMICON Europa event in Munich, Germany. This year’s SEMICON Europa event will be co-located with productronica, the...February 20, 2017
Shanghai New International Expo Centre, March 14-16, 2017. PiBond participates in SEMICON China event in Shanghai at the Nagase booth No. 5617 in hall W5....October 25, 2016
Alpexpo, Grenoble, October 25-27, 2016 – SEMICON Europa. PiBond participates in SEMICON Europa event in Grenoble, France. Our booth No. is 541. We exhibit our...October 19, 2016
Pibond is awarded patent for its SAP technology platform. Helsinki, Oct. 19, 2016 — PiBond today announced the latest key milestone in its innovative SAP...September 22, 2016
Rapidly emerging global megatrends such as Internet of Things, augmented reality as well as new waves of automotive and security related applications have become key...September 07, 2016
Taipei Nangang Exhibition Center, September 7-9, 2016 – SEMICON Taiwan 2016. PiBond participates in SEMICON Taiwan event in Taipei at the Grand Trend booth No....March 10, 2016
Shanghai New International Expo Centre, March 15-17, 2016 – SEMICON China 2016. PiBond participates in SEMICON China event in Shanghai at the Nagase booth No....January 01, 2016
Tokyo Big Sight, January 13-15, 2016 – Nepcon Japan 2016. PiBond participates in the NEPCON conference at Nagase booths E52-40 (Hall 6) and E21-13 (Hall...April 01, 2015
New spin-on hardmask materials -- SAP-100 product line -- enables most advanced semiconductor nodes as well as process simplifications HELSINKI, Finland, April 1, 2015 --...July 29, 2014
Helsinki, Finland July 29, 2014 - Pibond Oy, a speciality chemical investment vehicle, today announced its acquisition of the assets of Silecs Oy (www.Silecs.com)....