PiBond participates in SEMICON Taiwan event in Taipei at the Grand Trend booth No. 773. We exhibit our SAP product solutions for TSV fabrication, MEMS manufacturing as well as IC packaging. Similarly, our optical dielectrics are showcased. We welcome all conference participants to visit us and Grand Trend to learn of new material solutions which can improve processes and simultaneously decrease cost of ownership.
The products featured are:
PiBond is proud to announce that we have joined to Responsible Care program. Program’s goal is to improve safety and reduce environmental impact of...
May 03, 2021To enhance the service to the chip makers and meet the strong demand from Taiwan Market. PiBond has opened the branch in Hsinchu to...
March 29, 2021PiBond's materials are applied in tens of thousands monthly wafer starts in the manufacturing semiconductor devices. Many of the materials applied have an optical...
March 02, 2021PiBond participates in SEMICON China event in Shanghai, March 17-19, 2021. You can find us at the booth E7 7775. PiBond will exhibit spin coatable...
November 19, 2020The victory comes in the Category of Business Innovations on PiBond’s Silicon-Rich Materials for Advanced Semiconductor Fabrication. The Awarded innovation represents the latest technology...
October 22, 2020Whereas we have been a technology leading company in the semiconductor siloxane materials space for some years already. Now we have also made great...
September 16, 2020PiBond at IWAPS, 5-6 November 2020, Chengdu China PiBond presents ‘New silicon-based materials for semiconductor manufacturing processes’ at ‘International Workshop on Advanced Patterning Solutions’ (IWAPS...
September 10, 2020SEMICON Taiwan, September 23-25, Hall 1 (TaiNEX 1) PiBond participates in SEMICON Taiwan event in Taipei, Taiwan. You can find us at booth N0384. PiBond...
March 26, 2020Statement from us regarding the situation with currently ongoing COVID-19 pandemic. PiBond's statement
August 19, 2019PiBond at IWAPS, 17-18. October 2019, Nanjing, China PiBond presents ‘Enabling silicon-based materials for advanced and novel semiconductor manufacturing processes’ at ‘International Workshop on Advanced...
August 19, 2019TWTC Nangang Hall, September 18-20, 2019 PiBond participates in SEMICON Taiwan event in Taipei, Taiwan. You can find us at booth N0484 (4th floor). PiBond...
February 21, 2019Shanghai New International Expo Centre, March 20-22, 2019. PiBond will participate in SEMICON China event in Shanghai. You can find us at the booth 1737....
August 03, 2018Taipei Nangang Exhibition Center 1&4F, September 5-7, 2018 – SEMICON Taiwan 2018. PiBond participates in SEMICON Taiwan event in Taipei, Taiwan. You can find us...
February 27, 2018Thermal scanning probe lithography (tSPL) has been used to create patterns with sub-20 nm half pitch resolution. Pattern generation uses a thermally sensitive resist...
February 23, 2018Shanghai New International Expo Centre, March 14-16, 2018 PiBond will participate in SEMICON China event in Shanghai. You can find us at the Genes Tech...
August 17, 2017Taipei Nangang Exhibition Center, September 13-15, 2017 – SEMICON Taiwan 2017. PiBond participates in SEMICON Taiwan event in Taipei, Taiwan. You can find us at...
May 12, 2017Munich, Germany, November 14-17, 2017. PiBond participates in SEMICON Europa event in Munich, Germany. This year’s SEMICON Europa event will be co-located with productronica, the...
February 20, 2017Shanghai New International Expo Centre, March 14-16, 2017. PiBond participates in SEMICON China event in Shanghai at the Nagase booth No. 5617 in hall W5....
October 25, 2016Alpexpo, Grenoble, October 25-27, 2016 – SEMICON Europa. PiBond participates in SEMICON Europa event in Grenoble, France. Our booth No. is 541. We exhibit our...
October 19, 2016Pibond is awarded patent for its SAP technology platform. Helsinki, Oct. 19, 2016 — PiBond today announced the latest key milestone in its innovative SAP...
September 22, 2016Rapidly emerging global megatrends such as Internet of Things, augmented reality as well as new waves of automotive and security related applications have become key...
September 07, 2016Taipei Nangang Exhibition Center, September 7-9, 2016 – SEMICON Taiwan 2016. PiBond participates in SEMICON Taiwan event in Taipei at the Grand Trend booth No....
March 10, 2016Shanghai New International Expo Centre, March 15-17, 2016 – SEMICON China 2016. PiBond participates in SEMICON China event in Shanghai at the Nagase booth No....
January 01, 2016Tokyo Big Sight, January 13-15, 2016 – Nepcon Japan 2016. PiBond participates in the NEPCON conference at Nagase booths E52-40 (Hall 6) and E21-13 (Hall...
April 01, 2015New spin-on hardmask materials -- SAP-100 product line -- enables most advanced semiconductor nodes as well as process simplifications HELSINKI, Finland, April 1, 2015 --...
July 29, 2014Helsinki, Finland July 29, 2014 - Pibond Oy, a speciality chemical investment vehicle, today announced its acquisition of the assets of Silecs Oy (www.Silecs.com)....