PiBond presents at International Workshop on Advanced Patterning SolutionsAug 19th 2019

PiBond at IWAPS, 17-18. October 2019, Nanjing, China

PiBond presents ‘Enabling silicon-based materials for advanced and novel semiconductor manufacturing processes’ at ‘International Workshop on Advanced Patterning Solutions’ (IWAPS 2019).

The chemically amplified organic resists (CAR) have served the industry for decades. As the industry moves toward the last fin field-effect transistor (FinFET) process nodes, these materials may need replacement due to resolution and line roughness limitations in future extreme ultraviolet lithography (EUVL) patterning. Thus, inorganic materials have been considered as a viable alternative for the organic CAR in EUVL and have received increased attention in recent years. The need for novel material solutions for high resolution EUVL patterning has resulted in a significant change how the lithographic stack may be perceived. Based on the need of new materials and processes, PiBond has developed novel silicon-based EUVL resists and extended the material technology to other lithography wavelengths as the use of inorganic resist materials offer a pathway to improved throughput and overall process improvement. Recent achievements in the area of silicon-based resist materials, and lithography stack development will be discussed and summarized.

IWAPS provides a forum for the experts from industry and research institutions worldwide to present and discuss advanced pattering solutions and related challenges such as material, equipment, process, metrology, computational lithography and design optimization. The speakers at the workshop are selected by invitation only and represent a broad range of disciplines and covering a wide array of different lithography approaches and requirements. Presentations are arranged to be comprehensive, covering the current practice, the future trends and the challenges ahead. The workshop is intended to provide a platform for attendees from international and domestic institutions to interact and discuss some common challenges faced by the industry. It will also be an opportunity for people to learn more about the semiconductor R&D and business landscape in China.

PiBond welcomes everyone interested to discuss at IWAPS.

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