November 19, 2020

PiBond wins Quality Innovation Award of 2020

The victory comes in the Category of Business Innovations on PiBond’s Silicon-Rich Materials for Advanced Semiconductor Fabrication. The Awarded innovation represents the latest technology in advanced semiconductor components manufacturing. The innovation simplify lithography processes resulting improved quality, yield and throughput in an IC chip fabrication. Further the innovation reduces chemicals used in the manufacturing process and contributes to ecological and economical benefits. The award is granted by Laatukeskus Excellence Finland.



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November 19, 2020

PiBond wins Quality Innovation Award of 2020

The victory comes in the Category of Business Innovations on PiBond’s Silicon-Rich Materials for Advanced Semiconductor Fabrication. The Awarded innovation represents the latest technology...

October 22, 2020

PiBond trending in hottest companies in Finland rank

Whereas we have been a technology leading company in the semiconductor siloxane materials space for some years already. Now we have also made great...

September 16, 2020

PiBond presents at International Workshop on Advanced Patterning Solutions

PiBond at IWAPS, 5-6 November 2020, Chengdu China PiBond presents ‘New silicon-based materials for semiconductor manufacturing processes’ at ‘International Workshop on Advanced Patterning Solutions’ (IWAPS...

September 10, 2020

PiBond exhibits at SEMICON Taiwan 2020

SEMICON Taiwan, September 23-25, Hall 1 (TaiNEX 1) PiBond participates in SEMICON Taiwan event in Taipei, Taiwan. You can find us at booth N0384. PiBond...

March 26, 2020

Statement regarding the situation with the CoronaVirus pandemic

Statement from us regarding the situation with currently ongoing COVID-19 pandemic. PiBond's statement

August 19, 2019

PiBond presents at International Workshop on Advanced Patterning Solutions

PiBond at IWAPS, 17-18. October 2019, Nanjing, China PiBond presents ‘Enabling silicon-based materials for advanced and novel semiconductor manufacturing processes’ at ‘International Workshop on Advanced...

August 19, 2019

PiBond exhibits at SEMICON Taiwan 2019

TWTC Nangang Hall, September 18-20, 2019 PiBond participates in SEMICON Taiwan event in Taipei, Taiwan. You can find us at booth N0484 (4th floor). PiBond...

February 21, 2019

PiBond exhibits at SEMICON China 2019

Shanghai New International Expo Centre, March 20-22, 2019. PiBond will participate in SEMICON China event in Shanghai. You can find us at the booth 1737....

August 03, 2018

PiBond exhibits at SEMICON Taiwan 2018

Taipei Nangang Exhibition Center 1&4F, September 5-7, 2018 – SEMICON Taiwan 2018. PiBond participates in SEMICON Taiwan event in Taipei, Taiwan. You can find us...

February 27, 2018

10nm pattern generation using thermal scanning probe lithography enabled by simplified materials and processes

Thermal scanning probe lithography (tSPL) has been used to create patterns with sub-20 nm half pitch resolution. Pattern generation uses a thermally sensitive resist...

February 23, 2018

PiBond exhibits at SEMICON China 2018

Shanghai New International Expo Centre, March 14-16, 2018 PiBond will participate in SEMICON China event in Shanghai. You can find us at the Genes Tech...

August 17, 2017

PiBond exhibits at SEMICON Taiwan 2017

Taipei Nangang Exhibition Center, September 13-15, 2017 – SEMICON Taiwan 2017. PiBond participates in SEMICON Taiwan event in Taipei, Taiwan. You can find us at...

May 12, 2017

PiBond at SEMICON Europa

Munich, Germany, November 14-17, 2017. PiBond participates in SEMICON Europa event in Munich, Germany. This year’s SEMICON Europa event will be co-located with productronica, the...

February 20, 2017

PiBond exhibits at SEMICON China 2017

Shanghai New International Expo Centre, March 14-16, 2017. PiBond participates in SEMICON China event in Shanghai at the Nagase booth No. 5617 in hall W5....

October 25, 2016

PiBond materials for MEMS, TSV and IC fabrication at SEMICON Europa

Alpexpo, Grenoble, October 25-27, 2016 – SEMICON Europa. PiBond participates in SEMICON Europa event in Grenoble, France. Our booth No. is 541. We exhibit our...

October 19, 2016

PiBond pioneers a new material approach for MEMS and 3D IC manufacturing.

Pibond is awarded patent for its SAP technology platform.   Helsinki, Oct. 19, 2016 — PiBond today announced the latest key milestone in its innovative SAP...

September 22, 2016

New materials with high refractive index for optical applications

Rapidly emerging global megatrends such as Internet of Things, augmented reality as well as new waves of automotive and security related applications have become key...

September 07, 2016

PiBond materials for MEMS, TSV and IC fabrication at SEMICON Taiwan

Taipei Nangang Exhibition Center, September 7-9, 2016 – SEMICON Taiwan 2016. PiBond participates in SEMICON Taiwan event in Taipei at the Grand Trend booth No....

March 10, 2016

PiBond materials for MEMS, TSV and IC fabrication at SEMICON China

Shanghai New International Expo Centre, March 15-17, 2016 – SEMICON China 2016. PiBond participates in SEMICON China event in Shanghai at the Nagase booth No....

January 01, 2016

PiBond Advanced Materials for Optical Sensors, MEMS and IC Packaging at NEPCON in Japan

Tokyo Big Sight, January 13-15, 2016 – Nepcon Japan 2016. PiBond participates in the NEPCON conference at Nagase booths E52-40 (Hall 6) and E21-13 (Hall...

April 01, 2015

As Semicon Fabs Eye Solutions for Moore's Law Extension, Pibond Introduces a New Product Line for Logic, Memory, Power and MEMS Devices

New spin-on hardmask materials -- SAP-100 product line -- enables most advanced semiconductor nodes as well as process simplifications HELSINKI, Finland, April 1, 2015 --...

July 29, 2014

Pibond Oy announced its acquisition of the assets of Silecs Oy

Helsinki, Finland July 29, 2014 - Pibond Oy, a speciality chemical investment vehicle, today announced its acquisition of the assets of Silecs Oy (www.Silecs.com)....

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